ANALOGUE - Advanced Semiconductor Packaging Facility

Dicing Tool-Disco 3350

General:
The Disco 3350 Dicing Tool is a high-precision wafer and substrate dicing system designed for advanced packaging and heterogeneous integration applications. It enables accurate singulation of semiconductor wafers, glass interposers, and other multi-material substrates with minimal chipping or damage. The system is particularly suited for glass interposers with through-glass vias (TGVs) and fragile multi-layer structures, supporting high-density 2.5D/3D integration and chiplet-based assembly workflows.

Specifications:
Hardware: Disco 3350 Precision Dicing Saw

Allowed Materials:

Silicon wafers and interposers

Glass interposers (TGV-based)

Ceramics and organic substrates (ABF, PCB)

Multi-layer stacks for heterogeneous integration

Dicing Technology:

High-speed precision diamond blade cutting

Wet dicing with controlled coolant delivery

Groove and street dicing for singulation of fine-pitch devices

Integration Relevance:

Enables singulation of glass interposers and multi-layer substrates for 2.5D/3D integration

Supports chiplet separation for heterogeneous integration workflows

Minimizes mechanical stress and damage to fragile substrates

Complements die bonding, wire bonding, and hybrid bonding processes

Critical for preparing substrates and wafers for assembly in high-density packaging applications

Grinding Tool - Disco DAG 810

The Automated Surface Grinder (DAG810) is a high-precision material processing system tailored for advanced packaging and heterogeneous integration workflows. It is used for wafer-level and substrate-level planarization, thickness control, and surface finishing of components such as interposers, redistribution layers (RDLs), and package substrates. The system supports tight tolerances and ultra-smooth finishes required for reliable stacking, bonding, and integration of multi-material electronic systems.

Specifications:
Hardware: DAG810 Automated Surface Grinding System

Allowed Materials:

Semiconductor substrates: Silicon, SiC, GaAs

Advanced packaging materials: Glass interposers, organic substrates (ABF), ceramic carriers

Metallic layers: Copper, aluminum (for exposed surface finishing)

Processing Technology: Precision surface grinding for wafer/substrate planarization and thickness uniformity

Integration Relevance:

Enables wafer thinning for 3D IC stacking

Supports planarization for hybrid bonding and micro-bump interconnects

Improves surface quality for high-density interconnect reliability

Compatible with heterogeneous integration flows combining different materials and device types

Hesse-BJ653-2024 Wire Bonder 

General:
The Automated Wire Bonder (Hesse 653) is a high-precision interconnection system designed for advanced packaging applications and heterogeneous integration. It enables reliable electrical connections between semiconductor devices and package substrates through fine-pitch wire bonding. The system supports complex packaging architectures, including multi-die, system-in-package (SiP), and chiplet-based designs, ensuring high throughput, accuracy, and repeatability for modern microelectronics manufacturing.

Specifications:
Hardware: Hesse 653 Automated Wire Bonding System

 Allowed Materials:

Bonding wires: Gold (Au), copper (Cu), aluminum (Al)

Substrates: Silicon dies, organic substrates (ABF), ceramic packages, lead frames

Bond pads: Aluminum, copper, gold-plated surfaces

 Bonding Technology: Thermosonic wire bonding (ball and wedge bonding modes)

 Automation Features:

Programmable bonding recipes for multi-material systems

Vision alignment system for pad recognition and placement

Real-time process monitoring and quality control

Automated wire feed and bond parameter adjustment

Inspection & Quality Control:

• Integrated optical inspection for bond placement and integrity
• Pull and shear test compatibility for reliability verification

Control System: Advanced motion control with CNC/PLC interface and user-friendly programming environment

Integration Relevance:

• Enables high-density interconnects in system-in-package (SiP) and multi-die assemblies
• Supports chiplet integration through fine-pitch interconnect routing
• Provides reliable electrical connections for heterogeneous materials and device types
• Compatible with advanced packaging flows requiring high precision and scalability

Die Bonder Finetech Femto2

The Sub-micron Die Bonder (Finetech Femto2) is an ultra-high precision placement and bonding system designed for advanced packaging and heterogeneous integration, with strong compatibility for glass-based interposer technologies. It enables sub-micron alignment and bonding of dies, chiplets, and micro-components onto silicon, glass, or hybrid substrates. The system is particularly suited for hybrid bonding and flip-chip assembly on glass interposers, where ultra-flat surfaces, tight overlay accuracy, and low thermal mismatch are critical for high-density integration.

Specifications:
Hardware: Finetech Femto2 Sub-micron Die Bonding System

Allowed Materials:

Semiconductor dies: Silicon, SiC, GaAs, InP

Interposers: Glass interposers (TGV-based), silicon interposers

Substrates: Organic (ABF), ceramics, hybrid multi-material stacks

Interconnects: Cu pillars, micro-bumps (SnAg), hybrid Cu–Cu bonding interfaces

Bonding Technology:

• Flip-chip bonding (fine and ultra-fine pitch)
• Thermocompression bonding (TCB)
• Hybrid bonding (Cu–Cu and dielectric-to-dielectric)
• Adhesive bonding (low-temperature processes for glass compatibility)

Automation Features:

• Programmable bonding recipes for glass, silicon, and hybrid stacks
• Automated alignment with distortion correction for transparent substrates
• Real-time monitoring of force, displacement, and temperature
• High repeatability for multi-die placement on large-area interposers

Inspection & Quality Control:

• In-situ optical inspection with enhanced contrast for transparent materials
• Alignment verification for TGV (Through-Glass Via) structures
• Compatibility with post-bond inspection (X-ray, SAM)

Control System: Advanced motion control and process software for sub-micron alignment and multi-material integration

Integration Relevance:

• Enables precise chiplet placement on glass interposers with TGVs for high I/O density
• Supports hybrid bonding on ultra-smooth glass surfaces for next-generation interconnect scaling
• Addresses thermal mismatch challenges between glass, silicon, and organic materials
• Ideal for RF, photonics, and high-frequency applications leveraging low-loss glass substrates
• Facilitates heterogeneous integration of logic, memory, and photonic components on a common glass platform

Bond Tester Royce BJ653

The Bond Tester (BJ653) is a high-precision mechanical testing system designed to evaluate the integrity and reliability of interconnects in advanced packaging and heterogeneous integration. It is used for destructive and non-destructive testing of wire bonds, micro-bumps, and hybrid bonding interfaces. The system is particularly suited for assessing bond strength on delicate substrates such as glass interposers, where controlled force application and high measurement sensitivity are critical.

Specifications:
Hardware: BJ653 Bond Testing System

Tested Materials & Structures:

• Wire bonds: Gold (Au), copper (Cu), aluminum (Al)
• Interconnects: Micro-bumps (SnAg, Cu pillar), Cu–Cu hybrid bonds
• Substrates: Silicon, glass interposers (TGV-based), organic (ABF), ceramics

Testing Methods:

Wire pull testing

Ball shear testing

Die shear testing

Micro-bump shear and pull testing

Measurement Capability:

• Peak force detection
• Displacement tracking
• Failure mode identification (e.g., interfacial vs. cohesive failure)

Automation Features:

• Programmable test routines for multiple bond types
• Automated stage movement and test sequencing
• Recipe-based testing for different packaging technologies
• Data logging and statistical analysis

Inspection & Analysis:

• Integrated optical microscopy for test site alignment and failure inspection
• High-magnification imaging for small-pitch interconnects
• Post-test failure classification support

Control System: PC-based interface with precision motion control and real-time data acquisition

Integration Relevance:

• Validates interconnect reliability in chiplet and 3D integration schemes
• Essential for qualifying bonds on glass interposers with TGV structures
• Supports development of hybrid bonding and ultra-fine pitch interconnects
• Enables failure analysis and process optimization for heterogeneous systems
• Ensures mechanical robustness of interconnects across multi-material interfaces

NANODIMENSION DragonFly IV 3D printer

The DragonFly IV by Nano Dimension is an advanced additive manufacturing system designed for 3D printing of electronic circuitry and functional structures, with strong applicability in advanced packaging and heterogeneous integration. It enables fabrication of multilayer interconnects, embedded components, and complex routing directly onto or alongside substrates such as glass interposers. The system supports rapid prototyping and low-volume production of high-density electronic architectures, including chip-to-interposer redistribution and embedded passive structures.

Specifications:
Hardware: DragonFly IV Additive Electronics Manufacturing System

Allowed Materials:

• Conductive ink: Silver nanoparticle-based (Ag, proprietary)
• Dielectric ink: UV-curable photopolymer
• Substrates: Glass interposers, silicon wafers, organic substrates (ABF), ceramics (optional or hybrid processing)

Printing Technology: Multi-material inkjet 3D printing (simultaneous deposition of conductive and dielectric materials)

Automation Features:

• Automated multi-material deposition and layer stacking
• Digital workflow for rapid design iteration
• Minimal tooling requirements for prototyping complex interconnects

Integration Relevance:

• Enables rapid prototyping of redistribution layers (RDLs) on glass interposers
• Supports embedded passive components (capacitors, antennas) within interposer structures
• Facilitates low-volume fabrication of heterogeneous integration architectures
• Complements traditional processes (e.g., die bonding, grinding) in hybrid manufacturing flows
• Useful for RF and high-frequency applications leveraging low-loss glass substrates

XPTL DELTA

XPTL DELTA printing system (ANALOGUE project)is an open prototyping platform delivering reliable, repeatable, and durable results for high performance materials. Easy to operate and maintain. Ideal tool for R&D in various microelectronics applications.

Printing on the edge - Edge interconnections printing with high resolution traces (10 µm), possibility to print over the edge of glass, silicon and flexible foils.

Redistribution layer prototyping - All printed RDL structure, down to 1 μm or 1 μm L/S density, variable materials, for example, metallic nanoparticle paste and high viscous polyimide.

Chip interconnection - Reliable connection for flexible hybrid electronics and advanced IC packages, high-density interconnections on stacked chips (Resolution <10 μm or 10 μm L/S), no satellite droplets and line width homogeneity to prevent electrical shorts.

General:

The XPTL Delta Printing System is a high-precision micro-dispensing and patterning platform designed for advanced packaging and heterogeneous integration. It enables controlled deposition of functional materials such as conductive inks, adhesives, and dielectrics onto substrates including glass interposers. The system is particularly suited for redistribution layer (RDL) formation, underfill dispensing, and fine-feature patterning required in chiplet integration and multi-material electronic assemblies.

Specifications:
Hardware: XPTL Delta Micro-Dispensing / Printing System

Allowed Materials:

• Conductive inks: Silver, copper nanoparticle inks
• Dielectrics: Polymer-based insulating materials
• Adhesives: Epoxies, underfills, anisotropic conductive films (ACF)
• Functional materials: Solder pastes, encapsulants

Substrate Compatibility:

• Glass interposers (TGV-based)
• Silicon wafers and interposers
• Organic substrates (ABF)
• Ceramics and hybrid stacks

Printing Technology:

• Micro-dispensing / direct-write printing (pressure-driven or piezo-assisted)
• Drop-on-demand or continuous flow (process-dependent)

Inspection & Control:

• In-situ monitoring of deposition quality and alignment
• Integration with external metrology tools for thickness and continuity verification

Control System: PC-based interface with CAD-driven patterning and process parameter control

Integration Relevance:

• Enables RDL formation and repair on glass interposers
• Supports localized material deposition for heterogeneous integration (e.g., chiplet interconnect routing)
• Facilitates underfill and adhesive deposition for die attach processes
• Complements additive and subtractive processes in hybrid manufacturing flows
• Suitable for rapid prototyping of fine-pitch interconnects and embedded structures

Aurel C920 Screen Printer

 General:

The Aurel C920 Screen Printer is a precision thick-film and fine-feature deposition system designed for advanced packaging and heterogeneous integration applications. It enables patterned deposition of conductive, dielectric, and functional pastes onto a variety of substrates, including glass interposers. The system is widely used for forming redistribution layers (RDLs), metallization patterns, and passive components, supporting both prototyping and small-scale production of high-density electronic structures.

Specifications:
Hardware: Aurel C920 Screen Printing System

Allowed Materials:

Conductive pastes: Silver (Ag), gold (Au), copper (Cu)

Dielectric pastes: Glass-based and polymer thick films

Functional materials: Resistors, capacitive inks, solder pastes

Adhesives and encapsulants (application-dependent)

Substrate Compatibility:

• Glass interposers (TGV-based)
• Silicon wafers and interposers
• Ceramic substrates (e.g., alumina, LTCC)
• Organic substrates (ABF, PCBs)

Printing Technology: Screen printing (stencil-based patterned deposition)

Inspection & Quality Control:

• Optical inspection for pattern fidelity and registration
• Thickness and uniformity verification (external metrology compatible)

Control System: User-friendly interface for process setup, alignment, and parameter control

Integration Relevance:

• Enables formation of redistribution layers (RDLs) on glass interposers
• Supports metallization of TGV structures and contact pads
• Facilitates integration of embedded passive components (resistors, capacitors)
• Complements additive and bonding processes in heterogeneous integration workflows
• Suitable for RF and power applications leveraging low-loss glass substrates

X-ray and CT-scan tool for Bonding Inspection

General:

The X-ray Inspection Tool is a non-destructive imaging system designed for internal inspection and failure analysis in advanced packaging and heterogeneous integration. It enables high-resolution visualization of hidden structures such as micro-bumps, wire bonds, through-glass vias (TGVs), and embedded interconnects within multilayer assemblies. The system is particularly valuable for inspecting glass interposers, where optical methods are limited, and for verifying alignment, voiding, and structural integrity in complex multi-material stacks.

Specifications:
Hardware: X-ray Inspection and Computed Tomography (CT) System

Inspection Targets:

• Micro-bumps and solder joints (SnAg, Cu pillar)
• Wire bonds (Au, Cu, Al)
• Hybrid bonding interfaces (Cu–Cu)
• Through-glass vias (TGVs) and through-silicon vias (TSVs)
• Redistribution layers (RDLs) and embedded structures

Substrate Compatibility:

• Glass interposers (TGV-based, transparent but density-sensitive structures)
• Silicon wafers and interposers
• Organic substrates (ABF)
• Ceramic packages and multi-material stacks

Imaging Technology:

• 2D X-ray radiography
• 3D X-ray computed tomography (CT) for volumetric analysis

Resolution:

• 2D: Down to ~1–5 µm (system-dependent)
• 3D CT voxel size: ~1–10 µm

X-ray Source: Microfocus or nanofocus X-ray tube

Magnification: High geometric magnification for fine-feature inspection

Penetration Capability: Adjustable for low- and high-density materials (glass, metals, ceramics)

Defect Detection:

• Voids and delamination
• Cracks in glass interposers and interfaces
• Misalignment of dies and interconnects
• Incomplete bonding or solder defects

Stage & Positioning:

• Multi-axis stage for tilt and rotation (CT scanning)
• High-precision positioning for region-of-interest inspection

Automation Features:

• Programmable inspection routines
• Automated defect recognition (optional AI-based analysis)
• Batch inspection for multiple samples

Inspection & Analysis Software:

• 2D/3D reconstruction and visualization tools
• Measurement and metrology capabilities (void size, alignment, pitch)
• Data export for reliability and failure analysis

Control System: PC-based interface with integrated imaging and analysis software

Integration Relevance:

• Enables non-destructive inspection of buried interconnects in glass interposers
• Critical for validating hybrid bonding and micro-bump integrity
• Supports failure analysis in heterogeneous multi-material systems
• Ensures quality control in chiplet integration and 3D stacking processes
• Complements mechanical testing (e.g., bond testing) for comprehensive reliability assessment

High Resolution Microscopy for morphological inspection

General:
The Benchtop SEM is a compact, high-resolution imaging system designed for detailed surface and structural analysis in advanced packaging and heterogeneous integration. It enables visualization of micro- and nanoscale features, such as micro-bumps, wire bonds, through-glass vias (TGVs), redistribution layers (RDLs), and hybrid bonding interfaces. The system is particularly valuable for inspecting glass interposers and multi-material substrates where high magnification and surface sensitivity are required for quality control and failure analysis.

Specifications:
Hardware: Benchtop Scanning Electron Microscope (SEM)

Imaging Targets:

• Micro-bumps, solder joints, and bond pads
• Wire bonds (Au, Cu, Al)
• Hybrid bonding interfaces (Cu–Cu, dielectric-to-dielectric)
• Redistribution layers (RDLs) and fine metallization lines
• Surface morphology of glass interposers and ceramic/organic substrates

Resolution:

• Spatial resolution: 1–5 nm (high-end models), typically 5–10 nm for benchtop systems
• Magnification: 20× – 100,000× (material and instrument dependent)

Detection Modes:

• Secondary electron (SE) imaging for surface topography
• Backscattered electron (BSE) imaging for compositional contrast

Sample Compatibility:

• Glass interposers (planarized surfaces or TGV regions)
• Silicon wafers and interposers
• Organic substrates (ABF) and ceramic packages
• Mounted micro-components and multi-layer assemblies

Stage & Positioning:

• Motorized X-Y-Z stage with tilt and rotation
• High-precision sample positioning for repeatable imaging

Vacuum System:

• Compact benchtop vacuum chamber suitable for non-conductive materials (optional coating for glass or polymers)

Automation Features:

• Automated image capture and stitching for large-area inspection
• Pre-programmed imaging routines for multiple regions of interest
• Measurement and annotation tools integrated with imaging software

Inspection & Analysis Software:

• Quantitative measurement of line width, pitch, and feature size
• Surface roughness analysis
• Defect identification (cracks, voids, delamination)
• Image export for reporting and correlation with X-ray/optical inspection

Integration Relevance:

• Enables high-resolution inspection of fine interconnects on glass interposers and heterogeneous substrates
• Supports failure analysis and process optimization in hybrid bonding and chiplet integration
• Complements non-destructive X-ray inspection by providing surface and compositional details
• Critical for quality assurance of micro-scale features in multi-material packaging workflows
• Useful for R&D and prototyping of next-generation 2.5D/3D IC assemblies.

Video Measuring Systems for visual inspection 

General:

The Nikon VZ Series Video Measuring System is a high-precision optical metrology platform designed for dimensional inspection and alignment verification in advanced packaging and heterogeneous integration. It enables non-contact measurement of fine features, including micro-bumps, redistribution layers (RDLs), through-glass vias (TGVs), and substrate geometries. The system is particularly suited for glass interposers and multi-material assemblies where accurate XY measurement and flatness evaluation are critical for ensuring proper die placement, bonding, and interconnect reliability.

Specifications:
Hardware: Nikon VZ Series Video Measuring System

Measurement Targets:

• Micro-bumps, bond pads, and metallization patterns
• Redistribution layers (RDLs) on glass or silicon interposers
• Through-glass vias (TGVs) and substrate features
• Die, chiplet, and package dimensions
• Surface planarity and flatness verification

Measurement Technology:

• Non-contact optical video measurement
• Telecentric lenses for minimal distortion
• Multi-axis stage with automated movement

Resolution & Accuracy:

• XY resolution: ~0.1–0.5 µm (depending on lens and configuration)
• Z resolution: ~0.1–1 µm (focus-based height measurement)
• Repeatability: ±0.5 µm or better

Stage & Motion Control:

• Motorized XY stage with programmable scanning
• Automated Z-focus adjustment for height profiling
• Large measurement area for small-to-medium substrates

Automation Features:

• Programmable measurement routines for multiple points and features
• Multi-feature inspection and batch measurement capability
• Vision-based pattern recognition for automated alignment

Software:

• CAD overlay for feature comparison
• Dimensional analysis, tolerance verification, and reporting
• Data export for SPC, quality control, and process optimization

Integration Relevance:

• Provides critical dimensional verification for glass interposers and heterogeneous substrates
• Ensures proper alignment of dies and micro-bumps for hybrid bonding and chiplet integration
• Supports process control in RDL formation, die placement, and post-bond inspection
• Complements SEM and X-ray inspection by providing fast, non-destructive metrology of surface features
• Useful for both R&D prototyping and pilot-scale production of advanced packaging assemblies

Measurement Kits and Equipment