Dicing Tool-Disco 3350
Dicing Tool-Disco 3350
DAD3350 can handle a maximum of Φ8-inch. Selecting a 2.2 kW high-torque spindle (optional) makes it possible to process silicon up to difficult-to-process materials, such as ceramic. In addition, the microscope includes an air blow mechanism and a lens shutter to prevent contamination. Through condition monitoring the processing conditions and various other statuses can be known at any given time.
CAPABILITIES: To improve equipment productivity, auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed.
Blade Types & Sizes:
Diamond blades optimized for silicon, glass, and ceramic substrates
Blade widths from 20–100 µm (application-dependent)
Cutting Accuracy: ±2–5 µm
Kerf Width / Street Control: 20–50 µm typical, adjustable based on blade and substrate
Stage & Motion Control:
Multi-axis motorized stage with high-precision XY movement
Programmable cutting paths for complex layouts
Integrated fiducial alignment for wafer and substrate positioning
Automation Features:
Recipe-based cutting for repeatable singulation
Automated fiducial recognition for precise alignment
Real-time monitoring of blade wear and cutting force
Batch processing capability for high-throughput dicing
Cooling System:
- Integrated coolant delivery to minimize heat and prevent micro-cracks in glass or fragile substrates
Inspection & Quality Control:
- Optical verification of dicing lines and kerf quality
- Edge quality monitoring for chiplet and interposer integrity
- Compatibility with post-dicing inspection tools (e.g., SEM, optical metrology)
Grinder Tool-DAG 810
Grinding Tool - Disco DAG 810
The ASG is a precision grinding machine to remove the material from the workspace, enabling thinned microelectronic devices such as sensors, implantable, and quantum circuits. As an example, implantable devices such as neural probes applications (EP/X017516/1), require a precise and smooth finish to prevent damage to tissue. In wearables (EP/X034690/1), dies can be automatically thinned to improve mechanical resilience and flexibility, with improved reproducibility.
Grinding Wheel Type:
Diamond wheels (for silicon, glass, ceramics)
Fine-grit wheels for ultra-smooth finishing
Surface Finish: Up to Ra ~0.05–0.2 µm (process-dependent, suitable for bonding interfaces)
Thickness Control Accuracy: ±1–3 µm (critical for wafer thinning and stacking)
Min. Achievable Thickness: Down to ~50–100 µm (material-dependent)
Planarity (TTV): <2–5 µm across substrate
Table Size / Chuck: Vacuum or electrostatic chuck compatible with wafer and panel formats
Feed Resolution: Sub-micron incremental control for fine material removal
Spindle Speed: Variable, optimized for brittle and ductile materials (typically 1,000–3,000 RPM)
Automation Features:
Programmable grinding recipes for different materials
Automated thickness endpoint control
Multi-step grinding and polishing cycles
Minimal operator intervention for repeatability
Cooling System: Precision coolant delivery to minimize thermal distortion and subsurface damage
Control System: CNC/PLC-based interface with high-precision motion control and process monitoring
Hesse-BJ653-2024 Wire Bonder
Hesse-BJ653-2024 Wire Bonder
The automated wire bonder attaches fine wires, e.g. gold or aluminium, to nanoelectronic dies with high precision, throughput, reliability, and substrate-compatibility. Reducing manual intervention eliminates human error and improves the accuracy and consistency of the bonds with a high yield, required for sensors, quantum circuits, and RF micro-systems.
Wire Diameter Range: ~15–75 µm (material-dependent)
Bond Pitch Capability: Down to ~40–60 µm (fine-pitch applications)
Placement Accuracy: ±2–5 µm
Loop Height Control: Programmable, optimized for dense multi-tier interconnects
Bonding Force / Ultrasonic Control: Closed-loop control for consistent bond quality
Throughput: High-speed automated bonding (application-dependent, typically up to several wires per second)
Work Area / Handling: Automated handling for wafers, substrates, and packages
Die Bonder
Die Bonder Finetech Femto2
An automatic die bonder is required for placing dies, or components onto substrates/PCBs. For instance, magnetic sensors (EP/X031950/1) need the automatic die bonder to place the sensor array at the exact location required for optimal sensory performance. The die bonder supports micro-sensors and IC research, where reproducibility and reliability are an essential element in the research and large numbers of experiments are needed to optimise new bonding, substrate or semiconductor materials.
Placement Accuracy: ±0.5 µm (critical for high-density routing on glass interposers)
Alignment System: Dual high-resolution optical alignment with transparency compensation for glass substrates
Bonding Force Range: mN to N range with closed-loop control (optimized for brittle substrates like glass)
Temperature Control: Up to ~350–400°C (adjustable for low-CTE mismatch processes and glass constraints)
Stage Resolution: Nanometer-scale motion control for precise die-to-interposer alignment
Surface Requirements: Compatible with ultra-flat, low-roughness surfaces required for glass interposer bonding
Atmosphere Control: Optional vacuum or inert gas environment to prevent oxidation during Cu–Cu bonding
Bond Tester
Royce-600-Series-Bond-Tester
Bond testers validate the quality and reliability of bonded dies and wires, underpinning research on the reliability of nanoelectronics. Sensors, healthcare, and medical devices often use wire bonding to connect the sensing elements to the rest of the device. Testing the wire bonds’ quality and strength ensures the sensor/devices can accurately and reliably detect the intended physical quantity.
Force Range: mN to several hundred N (configurable for fine to robust structures)
Force Resolution: High-resolution load cells (sub-mN sensitivity for delicate structures)
Positioning Accuracy: ±1–2 µm
Shear Tool / Hook Types: Interchangeable tools for different bond geometries and pitches
Test Speed: Programmable displacement rates for standard and advanced reliability testing
Dragon Fly IV
NANODIMENSION Dragon FLY IV
A multi-material, multi-layer 3D printer that generates entire circuits in one step – including substrate, conductive traces, and passive components.
Layer Thickness: ~2–10 µm (material and process dependent)
Min. Trace Width / Spacing: ~75–100 µm
Vertical Resolution: <1–2 µm Z-resolution
Alignment Accuracy: ±20–30 µm (layer-to-layer registration)
Curing System:
- UV LED curing for dielectric layers
- Thermal sintering for conductive silver traces
Build Volume: Suitable for small-to-medium scale substrates and interposer prototyping
Surface Compatibility:
- Capable of printing on planarized glass interposers and smooth substrates
- Compatible with pre-processed surfaces (e.g., post-grinding or polishing)
Software: Nano Dimension Switch™ software suite (print preparation, slicing, alignment, and process control)
XPTL
XPTL DELTA
XPTL DELTA printing system (ANALOGUE project)is an open prototyping platform delivering reliable, repeatable, and durable results for high performance materials. Easy to operate and maintain. Ideal tool for R&D in various microelectronics applications.
Printing on the edge - Edge interconnections printing with high resolution traces (10 µm), possibility to print over the edge of glass, silicon and flexible foils.
Redistribution layer prototyping - All printed RDL structure, down to 1 μm or 1 μm L/S density, variable materials, for example, metallic nanoparticle paste and high viscous polyimide.
Chip interconnection - Reliable connection for flexible hybrid electronics and advanced IC packages, high-density interconnections on stacked chips (Resolution <10 μm or 10 μm L/S), no satellite droplets and line width homogeneity to prevent electrical shorts.
Feature Resolution: ~10–50 µm (material and nozzle dependent)
Line Width Control: Fine control for RDL and interconnect patterning
Layer Thickness: From sub-micron to tens of microns (application-dependent)
Positioning Accuracy: ±5–10 µm
Stage Resolution: Sub-micron motion control
Nozzle System: Interchangeable nozzles for varying viscosities and feature sizes
Curing / Post-Processing:
- Compatible with UV curing, thermal curing, or sintering (external or integrated modules)
Automation Features:
- Programmable deposition paths and multi-material recipes
- Vision-assisted alignment for precise pattern placement
- Automated dispensing control (pressure, गति, volume)
- Repeatable patterning for prototyping and pilot production
Aurel Screen Printer
AUREL Screen Printer
Aurel C920 Screen printer (ANALOGUE PROJECT) is a high precision free stand screen/stencil printing machine and meets the requirements for high quality automatic printing on large areas. The main application in the electronic are thick film, SMT, polymeric pastes, solar cells. C920 can be equipped with a vision system and two TV cameras to simplify the alignment operation between screen/stencil and substrate.
Feature Resolution: ~50–100 µm (screen and paste dependent)
Layer Thickness: ~5–50 µm per print (material and mesh dependent)
Alignment Accuracy: ±10–25 µm (with optical alignment system)
Printing Area: Suitable for small-to-medium substrates and panels
Screen / Stencil System:
- Interchangeable screens with fine mesh control
- Emulsion-defined patterns for high repeatability
Process Control Parameters:
- Squeegee speed, pressure, and angle control
- Snap-off distance and print gap adjustment
- Paste viscosity and rheology optimization
Curing / Post-Processing:
- Compatible with thermal curing and firing (e.g., furnace sintering for thick films)
- UV curing for selected dielectric materials
Automation Features:
- Semi-automatic or fully programmable print cycles
- Vision-assisted alignment for multilayer registration
- Repeatable deposition for batch processing
Training
Details about equipment training will be published when scheduled.
Watch this space!