2026

Zhang, Tianwei, Harwell, Jonathon, Cameron, Joseph ORCID: https://orcid.org/0000-0001-8622-8353, Zhang, Shoushou, Heidari, Hadi ORCID: https://orcid.org/0000-0001-8412-8164 and Kettle, Jeff (2026) Design for recycling in electronic manufacturing: enabling circularity and lower impact manufacturing through heterogenous integration and lower impact recovery. npj Materials Sustainability, 4, 10. (doi: 10.1038/s44296-026-00098-8)

Harwell, Jonathon R., Zhang, Tianwei, Rollo, Andrew, Wagih, Mahmoud ORCID: https://orcid.org/0000-0002-7806-4333 and Kettle, Jeff (2026) Additively manufacturing printed circuit boards with low waste footprint by transferring electroplated zinc tracks. Communications Materials, 7, 17. (doi: 10.1038/s43246-025-01031-7)

2025

Shojaei Baghini, M. et al. (2025) Bio-integrated µBots with overtone ultra-wideband magnetoelectric antennas for wireless telemetry. arXiv, (doi: 10.48550/arXiv.2512.12311)

Alsulami, Bashayer Nafe, Harwell, Jonathon, Zante, Guillaume, Abbott, Andrew P., Feeney, Andrew ORCID: https://orcid.org/0000-0001-7170-1830 and Kettle, Jeff (2025) Hybrid delamination of silver contacts from c-Si solar cells: a low environmental impact recycling approach. Resources, Conservation and Recycling, 221, 108429. (doi: 10.1016/j.resconrec.2025.108429)

Kettle, Jeff, Mukherjee, Rudra ORCID: https://orcid.org/0000-0002-7307-3599, Zhang, Shoushou, Harwell, Jonathan, Bainbridge, Andrew, Wagih, Mahmoud ORCID: https://orcid.org/0000-0002-7806-4333, Martinez Diez, Ana, Menendez Suarez, MariFe and Sanchez, P.ascal (2025) Towards an Internet of Things circular economy using printed circuits on reusable steel substrates. Advanced Electronic Materials, 11(5), 2400529. (doi: 10.1002/aelm.202400529)

2024

Zhang, Tianwei, Bainbridge, Andrew, Harwell, Jonathon, Zhang, Shoushou, Wagih, Mahmoud ORCID: https://orcid.org/0000-0002-7806-4333 and Kettle, Jeff (2024) Life cycle assessment (LCA) of circular consumer electronics based on IC recycling and emerging PCB assembly materials. Scientific Reports, 14, 29183. (doi: 10.1038/s41598-024-79732-1) (PMID:39587208) (PMCID:PMC11589699)

Articles

Zhang, Tianwei, Harwell, Jonathon, Cameron, Joseph ORCID: https://orcid.org/0000-0001-8622-8353, Zhang, Shoushou, Heidari, Hadi ORCID: https://orcid.org/0000-0001-8412-8164 and Kettle, Jeff (2026) Design for recycling in electronic manufacturing: enabling circularity and lower impact manufacturing through heterogenous integration and lower impact recovery. npj Materials Sustainability, 4, 10. (doi: 10.1038/s44296-026-00098-8)

Harwell, Jonathon R., Zhang, Tianwei, Rollo, Andrew, Wagih, Mahmoud ORCID: https://orcid.org/0000-0002-7806-4333 and Kettle, Jeff (2026) Additively manufacturing printed circuit boards with low waste footprint by transferring electroplated zinc tracks. Communications Materials, 7, 17. (doi: 10.1038/s43246-025-01031-7)

Shojaei Baghini, M. et al. (2025) Bio-integrated µBots with overtone ultra-wideband magnetoelectric antennas for wireless telemetry. arXiv, (doi: 10.48550/arXiv.2512.12311)

Alsulami, Bashayer Nafe, Harwell, Jonathon, Zante, Guillaume, Abbott, Andrew P., Feeney, Andrew ORCID: https://orcid.org/0000-0001-7170-1830 and Kettle, Jeff (2025) Hybrid delamination of silver contacts from c-Si solar cells: a low environmental impact recycling approach. Resources, Conservation and Recycling, 221, 108429. (doi: 10.1016/j.resconrec.2025.108429)

Kettle, Jeff, Mukherjee, Rudra ORCID: https://orcid.org/0000-0002-7307-3599, Zhang, Shoushou, Harwell, Jonathan, Bainbridge, Andrew, Wagih, Mahmoud ORCID: https://orcid.org/0000-0002-7806-4333, Martinez Diez, Ana, Menendez Suarez, MariFe and Sanchez, P.ascal (2025) Towards an Internet of Things circular economy using printed circuits on reusable steel substrates. Advanced Electronic Materials, 11(5), 2400529. (doi: 10.1002/aelm.202400529)

Zhang, Tianwei, Bainbridge, Andrew, Harwell, Jonathon, Zhang, Shoushou, Wagih, Mahmoud ORCID: https://orcid.org/0000-0002-7806-4333 and Kettle, Jeff (2024) Life cycle assessment (LCA) of circular consumer electronics based on IC recycling and emerging PCB assembly materials. Scientific Reports, 14, 29183. (doi: 10.1038/s41598-024-79732-1) (PMID:39587208) (PMCID:PMC11589699)